X-Rays at Work

In This Section...

  • Phase-Contrast for the Life Sciences

    Phase-contrast for the life sciences

    Because phase-contrast is so sensitive to low density materials it is able to produce extremely high contrast images of a wide range of  life science samples - including small animal parts, bone samples, tissue samples, seeds, plant materials, paper, wood and many more. Furthermore, phase contrast with appropriate phase retrieval is a particularly powerful technique as it combines extreme imaging sensitivity with excellent tomographic dimensional fidelity.

  • Phase contrast Imaging

    Phase-contrast imaging

    XRT is the pioneer in phase contrast X-ray imaging using groundbreaking technology originally developed by CSIRO (Commonwealth Scientific Industrial Research Organisation) Australia. XRT holds international patents in the field which are in effect in most.countries of the world including Japan, Asia, Europe and USA. Phase contrast is strong where absorption contrast is weak, for low density materails and at higher x-ray energies.

  • Phase Retrieval

    Phase retrieval for accurate sample measurements

    The observed natural edge enhancement in a phase contrast image is produced by refraction/propagation effects and although it gives excellent image contrast it is not linear and does not in itself always give an accurate indication of the thickness or density of the sample. Phase retrieval however transforms this observed intensity distribution into a retrieved phase distribution which can more accurately reflect sample structure. Application of phase retrieval to an in-line X-ray image thus allows one to obtain important qualitative information directly from the phase retrieved image (such as the shape and thickness of the object), as well as quantitative data about the internal composition of the sample (i.e. projected electron-density distribution).

  • Phase-Contrast MicroCT

    Phase-contrast microCT

    IIt is well known that phase contrast imaging is particularly useful for X-ray imaging of structures made from weakly absorbing materials, either alone or in the company of more dense structures. X-ray micro tomography progressively rotates the sample through 180 degrees or 360 degrees taking an image at preset intervals, typically every half or quarter degree. The images are then reconstructed using a back-projection algorithm to allow a 3D model of the structure to be derived which can then be visualised, virtually cut and virtually sliced using specialised software.

  • Phase Imaging

    Phase retrieval restores resolution to phase images

    All X-ray images contain both absorption and phase contrast information. Both types of image data supply information about structures within the sample under investigation. Phase retrieval aims to extract the phase or the phase and amplitude distribution of X-rays immediately after they pass through the sample.

  • LPSCPoster (PDF) 877KB

    Location of cometary dust particles in Aerogel

    XRT Limited has been working in collaboration with the Stardust team at the Institute for Geophysics and Planetary Physics, Lawrence Livermore National Labs to study cosmic dust particles captured in aerogel using x-ray phase contrast microscopy. This work will be continued on actual cometary dust particles brought back in the Stardust spacecraft which has just returned to earth.

  • Delamination (PDF) 575KB

    Fault isolation and failure analysis in semiconductor manufacturing: Within-die delamination and cracking

    High resolution phase contrast X-ray imaging can help to detect faults and analyse failures within semiconductor devices. Here we show an example of imaging within-die delamination and cracking.

  • FlipChip (PDF) 290KB

    Fault isolation and failure analysis in semiconductor manufacturing: Failure of flip-chip packaging

    High resolution phase contrast X-ray imaging can help to detect faults and analyse failures within semiconductor devices by revealing failure of flip-chip packaging.

  • EMFA (PDF) 662KB

    Fault isolation and failure in semiconductor manufacturing: Electromigration failure analysis

    Voiding in component interconnects is a significant source of failure in semiconductor devices.

  • 50nmResolution (JPEG) 1360KB

    Towards 50nm resolution with an X-ray microscope

    Advances in technology make ~50nm spatial resolution possible for the first time.